Sony Corp. and Toshiba Corp. will jointly develop processing and design technology for producing system large-scale integrated circuits with widths of 0.07 micron to 0.1 micron, the two announced Thursday.
Development will commence later this month at Toshiba Advanced Microelectronics Center in Isogo, Yokohama, and continue until the end of fiscal 2003, with an investment of about 15 billion yen.
A team of 130 engineers from the two companies will be assembled for the joint project.