Huawei Technologies unveiled new technology from memory chips to AI accelerators Thursday, outlining publicly for the first time its multiyear plan to challenge Nvidia’s dominance in a growing market.
The highlight of the company’s presentation on Thursday were new SuperPod cluster designs that will allow Huawei to link as many as 15,488 of its Ascend neural processing units for artificial intelligence and operate them as a coherent system, rotating chairman Eric Xu said at the event. Those SuperPod products will be built with new generations of Ascend chips from next year.
The next-generation Ascend 950 series will be accompanied by new high-bandwidth memory designed by Huawei itself, Xu said, without elaborating on who will fabricate the semiconductors. Huawei also plans to roll out an Ascend 960 in late 2027, to be succeeded by a 970 model in late 2028.
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