• Kyodo


SoftBank Group Corp. said Thursday it will raise a total of ¥533.7 billion through a series of new corporate bond issues later this month for debt repayment and to acquire working capital.

The telecommunication and Internet business group will issue 7-year and 10-year dollar-denominated bonds for institutional investors abroad excluding those in the United States, raising $2 billion.

The company will also issue euro-denominated bonds worth €2.3 billion, maturing between July 2022 and July 2027, to non-U.S. institutional investors.

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