Toshiba Corp. and Samsung Electronics Co. said Wednesday they have agreed to use a common interface specification to produce dynamic random access memory chips for business-use, high-speed network applications.

The Japanese and South Korean chip firms said the agreement is designed to secure market leadership and ensure their customers receive a stable supply of DRAM chips. The clients are primarily computer server makers.

Toshiba and Samsung will independently manufacture and market high-speed network DRAM chips, but their products will be fully compatible due to their common specifications, they said.

Toshiba has already commercialized high-speed network DRAM chips. Samsung is scheduled to launch these products between July and September.

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