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Canon Inc. and Toshiba Corp. said Thursday they will jointly develop new-generation wafers that will produce faster, more energy-efficient semiconductors.

Toshiba, a leading electronics maker, aims to produce digital consumer electronics and mobile devices using new silicon-on-insulator wafers, possibly beginning in 2004. Canon, Japan’s biggest office machine maker and a major maker of semiconductor equipment, began development studies on SOI wafers in 1990 and plans to supply its SOI wafers to Toshiba on a commercial basis, a Canon spokeswoman said.

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