Nikon Corp. is working with U.S. chipmaker Intel Corp. to develop a next-generation semiconductor stepper that increases production efficiency and reduces costs, a senior company official said.
“We are receiving financial support for the development,” Executive Vice President Junichi Ito told a news conference Wednesday. He declined to disclose the amount of support from Intel, a major business partner of the camera and microchip equipment maker.
Nikon and Intel are developing an exposure device capable of handling semiconductor wafers with a diameter of 450 mm, bigger than the most dominant ones.
In addition to the tieup with Nikon, Intel plans to invest in Dutch exposure device manufacturer ASML, a move seen aimed at forcing ASML and Nikon to compete in developing the device.